The Study Of Millimeter Wave Up Converter Module

In recent years, the United States, Japan, Korea and other countries have opened up the use of millimeter wave band without licensed, thus further stimulating the study of millimeter-wave CMOS technology, making the study of millimeter wave becomes a hot field of military and commercial wireless communications. As the critical component of millimeter wave communication system, conversion module move the spectrum of signal that coded or decoded, modulated or demodulated, filtered in the IF or lower band to the millimeter wave band to meet the requirements of transmission, its technical performance will directly affect the performance of the entire system.This subject mainly studies the conversion module of Q millimeter wave band, based on the current research status of millimeter wave technology, in the form of planar hybrid integrated circuit, this paper mix the L-band 500 MHz IF1 signal with the C-band four interval 500 MHz LO signal respectively through a single-pole four-throw switch, then the mixing product 6-8GHz is mixed with aK-band LO signal 37.5GHz again to obtain a Q-band RF signal of 2GHz bandwidth, thus not only up-converting the signal but also achieving the spread spectrum of signals at the same time. Finally, the two modules were tested cascaded, the result shows that the RF output power is greater than 3dBm, and phase noise is better than-70dBc/Hz@1KHz and-80dBc/Hz@10KHz.According to the method of modularized circuit, the up-conversion module is divided into two smaller modules, which are microwave module and millimeter wave module, the spreading spectrum of signal is fully implemented in the first mixing. For the low frequency, the design of the circuit structure is simple and easy to filter out spurious to make the output spectrum pure. Considering miniaturization and low cost, the designs of the LO source circuits in the module are adopted PLL chips integrated VCO instead of the traditional way, thus reduces the difficulty of the design and the debugging of the circuit, and obtain a lower power consumption.The paper then respectively completed the development and testing of each module, analyzed and discussed the design of each module in detail, including decomposition design specifications, selection of key components and passive circuit design and debugging, and the modules assembled and tested. In addition, this paper described the details in the design which require attention and problems encountered in the process of debugging and then the corresponding solutions were proposed.