Mask Rom Design For A Certain Type Of MCU

With the development of advanced manufacturing techniques and a more and more developed economy, China has become an important electronic products production base and consumption power. The market demand for chips with varieties of functions has been increasing..As one of them, the MCU chip has been used in many kinds of electronic products, for its high quality with low price. The intense competition in market makes it more rigorous for cost control of MCU producers. As a key factor to influence the cost of MCU,ROM has attracted great attention from the MCU designers.The whole read-only Memory module as in the overall design scheme was determined, according to the technical indexes of each circuit module design. When designing storage array, we puts forward a new kind of structure:flat-cell structure. Because flat-cell array is designed in active part, and is a platform structure, it uses PN to insulate the cell, and does not contain field oxide. So it doesn’t decrease the width of the channel when the field oxide’s dope distributes again, and it doesn’t turn up bird’s mouth, so as the narrow channel effect. In this way, it can decrease the area of the cell and makes the density higher and also makes the character available, and low price production. The flat-cell drastically improves the ROM characteristics. Based on the Flat-Cell technology design of the mask exposure in read-only memory function and performance, reflects this advantage, along with the development of technology, the smaller size of the Flat-Cell will become the mainstream of the manufacturing mask exposure storage industry, because it is compatible with CMOS technology, there will be more to for IC designers mask, the more mask exposure will make it the first choice of ROM processors.