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Physical Design For3G Baseband Chip With40nm Technology

Posted on:2013-08-23Degree:MasterType:Thesis
Country:ChinaCandidate:J C QiuFull Text:PDF
GTID:2248330395456301Subject:IC Engineering
Abstract/Summary:PDF Full Text Request
Along with the development of mobile communication system recently, the design of mobile terminals encounters more and more challenges. The performance and the cost of the mobile terminals are mainly depended on the baseband chip. When the mobile communication system develops from2G and2.5G to current3G, the baseband design is also changed.This thesis introduces the implementation for the3G baseband chip under40nm technology. It mainly discusses the updates of the traditional design flow and design methodology after including the UPF file which is used to describe the low power design flow. In this design, I research the current low power design methodology and standard; define the low power design intent and parameter by using UPF file according to the UPF version1.0; introduce the UPF flow into traditional logic synthesis flow to insert the related control logic and achieve the low power design; research and analyze the multi-voltage/multi-power design issues in netlist, do the design rule check, analysis and correction based on the design rule requirement to achieve the low power design intent; research and analyze the common power network issue in the multi-voltage and multi-power design; find the efficient solution to reduce the static IR-drop; introduce the UPF flow into Static Timing Analysis flow to improve the accuracy of the timing analysis; also research the new flow to speed up the timing closure.With my research and analysis in this thesis, I analyze the common issues in logic synthesis, low power design and timing analysis which are using40nm design technology. I also provide the efficient solution to resolve the issues to make sure the correction of design functionality and requirement. The final design results show that we reduce the IC design loops and improve the reliability of our chip by paying much attention on the issues I analyze. The3G baseband chip is already tapeout successfully on2010, and the3G smart phones using this chip is already saling in market.
Keywords/Search Tags:UPF, Synthesis, MVRC, STA, Static IR_drop, DMSA
PDF Full Text Request
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