The Analysis Of Thermal Characteristic Of The Fiber-Coupling Module And The Study Of Its Packing Technology

The analysis of the thermal characteristic of semiconductor laser diode by the point of view of the device packing technology has been presented in this paper. The main analysis is the device temperature distribution and thermal resistance. There are several factors can influence the thermal characteristic of semiconductor laser diode, for instance, chips, solder, heat sink, sintering type, etc. In this paper, we are going to study on the influence of the device temperature distribution and thermal resistance through the followed four aspects: up-mounted chip and flip-chip, diamond, Si, SiC, AlSiC, CuW90, CuW55, Cu seven types of the materials of heat sink, PbSn, AgSn, SnAgCu, In four kinds of solder and a modified C-mount heat sink.By the result of the ANSYS simulation analysis, we found that the temperature distribution in the active region of semiconductor laser diode is nonuniform. Most of the heat concentrated near the fore face, and in the same situation, the efficiency of heat dissipation of flip-chip is better than the up-mounted one; Changing the materials of heat sink has a big effect to the temperature rise of the active region, from the simulated figure of temperature distribution and thermal resistance, we could found that the diamond is the best choise and it has a great therma characteristic, the thermal resistance of diamond is2.825℃/W, but because it is difficult to be manufactured, and its high cost, then we choose Cu to be the material of heat sink for experiment; In has the lowest thermal resistance in these four kinds of solder; We can get lower thermal resistance by improving the outline of C-mount heat sink, and it can also reduce the temperature difference between the two faces of the chip.Based on the summary of packing technology and analysed result of ANSYS, a808nm semiconductor laser diode was successfully packed, we tested it and then worked out its coupling efficiency.