| The thermal characteristics is an important factor for the degradation,stability and output power of the laser diode. Therefore, thermal simulation and analysis of the laser diode are an important subject for packaging.Based on the thermal characteristics technology for high-power Laser diode series modules have been studied on this essay. A simulation method, which is based on ANSYS finite-element software, has been used for the thermal characteristics analysis of the laser diode series modules. By using this method, we got the thermal distribution nephogram as well as the thermal resistances of the laser diode series modules. The thermal analysis of the laser diode series modules with different environment conditions and packaging structure parameters, different heat-sink shape,heat-sink material also have been analysis and got the results. At last, the laser diode series modules also have been characterized by Pulse I-P and I-V methods on different boundary conditions, which all confirmed the validity of our analysis.Based on ANSYS finite-element software, we have studied the thermal characteristic of the laser diode under isothermal boundary conditions and convective boundary conditions. we find that under convective boundary condition, it's can not be effectively distributed because of the thermal rollover, and the external heat dissipation is the most important key problem of the device temperature rises. We also find that under isothermal boundary condition, due to heat can be distributed in time, the internal thermal resistance and heat distribution leading role on the module temperature rises.Ultimately, accordance with the results of simulation and optimization, a temperature control system for laser diodes series modules have been designed, packaging and systematically characterized. |
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