Thermal Analysis Of Laser Chip With Different Sise Based On C-Mount Packaging

With the development of Semiconductor Laser technology and the increasing of the output power, the laser thermal effect which has become the main obstacle to the development of high power Semiconductor Lasers.The thermal-resistance is usually used as the cooling capacity of Semiconductor Lasers.In this paper,we made a Semiconductor Laser with strip width of 150μm and cavity length of 1000μm,which sintered on C-Mount heat sink with In solder.At the same time, we packaged the Laser with TO-3.We measured the Thermal-resistance of several 3W Lasers which are based on C-Mount heat sink with wavelength shift method.The Thermal-resistance that we get are between 5.3℃/W-5.9℃/W. We simulated the Thermal-resistance of Semiconductor Laser with ANSYS Finite element thermal analysis software on ideal conditions,and we introducted the contact resistance caused by the empty in In solder through the measured and simulated results. We used ANSYS software simulate the Thermal-resistance of Laser after introduct the contact resistance,and it's value and the measured results are basically consistent We used the same method to simulate the Thermal-resistance of different chip size of Lasers,which based on C-Mount heat sink.In this paper,we measured the temperature rise of different duty cycles of 3W Lasers, the results show that the different duty cycle of the temperature rise are different, which 0.5% duty cycle is about 20% to continues conditions of temperature rise. We used ANSYS software to simulate the temperature rise of 100% duty cycle,from simulation,and it could get that the temperature rise is 36% of the steady state in I ms.and the temperature rise is 95% of the steady state in 0.1 s. Therefore, even if the laser under the conditions of 0.5% duty cycle work, the temperature should not be negligible.