Design And Implementation Of10Gb/s XFP Optical Transceiver Module

As the exponential growth of global amount of information, higher demands on bandwidth and capacity of communication network are required. The biggest advantage of optical fiber communication is its enormous potential bandwidth capacity of nearly30THz. With the rapid development, optical fiber communication technology has been to become mainstream technology of communication network in today’s information society. The optical module is an important sub-module in optical network. It is used to realize optical-electro, electro-optical conversion. Since its inception in1999, transfer rate of the optical module has been continually promoted, from155Mb/s,622Mb/s up to2.5Gb/s,10Gb/s or even40Gb/s. At present,10G optical transceiver module has gradually entered the mainstream market. Because of its small size and low cost, the XFP module with digital diagnostics is considered to be the most advantageous type in various10G modules.In this context,10Gb/s XFP SR optical transceiver module with DDM is researched on this article. Firstly, essential protocols of10Gb/s XFP optical transceiver module is researched, including the INF-8077i protocol and a custom protocol. Among them, the pin definition of XFP module and time-series analysis in8077i protocol are foundations for hardware circuit design, XFP2-Wire Interface Protocol is the theoretical foundation of of the implementation of communication, digital diagnostic monitoring interface and the custom protocol is used for digital diagnostics. Secondly, on the basis of the XFP optical module working principles, combined with the design goal of this article, essential devices and chips of the design are selected, and the schematic of the XFP optical transceiver module is determined according to high-speed circuit design techniques. Then, based on signal integrity analysis, high-speed PCB design for the XFP optical module on this paper is researched, including laminated design,impedance design, EMC design, layout and wiring design. Power integrity design is simulated by Cadence software, thus ensuring the continued optimization of PCB design. Finally, the implement of XFP DDM(Digital Diagnostic Monitoring) function is studied on the paper. On basis of the realization of parallel port to I2C communication and USB interface to I2C communication, the monitoring software is completed by using the object-oriented thinking to enable the reusability and scalability.The transmit and receive sections of XFP module are tested to verify the performance of the module. The results show that indicators of the module can meet the design requirements, including eye-diagram quality, launched optical power, extinction ratio, sensitivity and other important indicators. At the same time, the monitoring software works well. It can implement DDM by detecting module status real-time.