High Speed Digital Circuit Simulation And Validation Based On Singal Integrity Analysis

Deep sub-micron technology has been widely used in IC design and manufacturing along with the rapid development of microelectronic technology. And how to guarantee the signal integrity of design is becoming one of the key factors for the PCB fabrication success rate. In this thesis, through signal integrity simulations in the pre phase of designing process and verifications in the post phase, adjusting and optimizing circuits, ensuring signal integrity, the success rate of PCB fabrication has been greatly improved.Based on the investigation of the signal integrity from various buses, this thesis initiated a kind of solution which covered the signal integrity simulation and validation for the whole designing phase. This solution consisted of signal integrity simulations and validations for different designing phases and for different bus characteristics, including USB bus compliance and eye-diagram tests, post simulation for Hyper Transport bus, amplitude and timing tests for DDR II bus. And then this solution provided a more reliable signal integrity assurance scheme for high speed digital circuit design.