| Inductively coupled wireless connection 3-D stacked package is a pure physical way to improve the integration level of circuits. It can further increase the capacity of memory and reduce the area of chips when inductive coupling wireless connection is applied to mass storage. However, the study of inductive coupling wireless connection used in mass storage is in the initial stage, and there is no special interface for transmission and control. To facilitate its application in the mass storage, a simple and easy transfer protocol and interface is required to be designed.This paper starts from the particularity of the inductive coupling transmitting channels, and it focuses on two problems which must be solved when signal is transported by the inductive coupling transmitting channels. This paper puts forward a simpler and more effective communication protocol, thus it makes the transmission of inductance channel become more practical. In addition, on the basis of this transfer protocol, this paper designed a corresponding serial-transmission interface about memory. And according to the use of semi-real-time transmission, the utilization rate of channel transmission is improved, and through the designing of auto reset, there are no external reset lines in chips, so the area of chip is saved. In addition, the serial transmission interface for a specific memory - flash memory is detailedly designed on the basis of the above results.The design about serial interface simulated in modelsim and experimental results shows that the laying of the inductor can be completed quickly and easily by transmission protocol and transmission interface can transmit the signal which is from the outside into the chip fast and correctly, and it can provide the correct signal for memory access. |