| Three-dimensional stacked encapsulating of chips is a kind of method of system integration which possesses many advantages, and chips-superconnect technique is the key to achieve three-dimensional stack. The high-performance inductive coupling wireless connection technique used to three-dimensional stacked encapsulating studies and designs the transceiver module of inductive coupling wireless connection. The transceiver module is possessed of little parasitic effect, high-quality communication, low cost and high performance.At first, the basic communication theory of inductive coupling wireless connection is introduced and the formal statistic communication and transmission among several chips is analyzed. In the following, the working principle of transceiver module and the controlling principle of number controlling chips are presented. And then the design of transceiver module, multilevel metallic spiral inductor, Single-Ended emitter and nonreturn-to-zero processing transceiver are stated in the article. For help to test, the current controller is adopted in emitter and signal amplifier and sorted circuit are added in transceiver to enhance the received capability and reduce the deformation of signals. In the end, the proportion between width and length of each MOS is introduced in designing circuit and the circuit of transceiver module is simulated and analyzed.In the platform of Linux and the environment of cadence, the Hejian 0.25umCMOS technique is adopted to simulate and analyze the transceiver module of inductive coupling wireless connection. According to the result, the dispatching and received signals sent by the transceiver module of inductive coupling wireless connection proposed in this article are basically the same and do not deform. The phenomenon shows that the transceiver module of inductive coupling wireless connection possesses high quality and little parasitic effect and has reached a higher level. |
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