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Keyword [In-Solder]
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1. Research In Study Algorithm For Fuzzy Neural Network And Application In Solder Joint Quality Evaluation
2. Thermal Analysis Of Laser Chip With Different Sise Based On C-Mount Packaging
3. Investigation On The Relationship Between The Microstructure Evolution Of The Intermetallic Compounds In Solder Joints And The Micro-and Macro-mechanical Behavior
4. Experimental Investigation Of The Mechanical Behavior Of IMC In Solder Joints Under Various Strain Rates
5. Research On Image Matching Algorithm In Solder Joint Inspection System
6. Research On The Reliability Of Electromigration In Solder Bump Of Flip Chip Packaging Under Multi-physics Coupling
7. Research On Phase Measurement Profilometry In Solder Paste 3D Online Inspection
8. Experimental study of void formation in solder joints of flip-chip assemblies
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