Components Of Multi-chip Thermal Analysis And Thermal Design Technology Research

The thermal analysis and design of multi-chip module (MCM) are very important and indispensable because these are the key step to raise the reliability of multi-chip module, which usually work in the circumstance of high temperature and high moisture. The thesis has made a thorough research of the thermal analysis and design of MCM with the help of the finite element software(ANSYS 8.0) to evaluate nicely and quickly the thermal performance, which is deeply influenced by packaging parameters, and puts forward the methods to improve the radiating performance and reliability of MCM, Moreover, the thesis presents six projects that improve the radiating performance of large-power MCM on the basis of analyzing the thermal performance of large-power MCM using the software (ANSYS 8.0). In general, the main work of this thesis follow as:1. Has obtained the main influencing factors of thermal performance of MCM under different outer circumstances and packaging parameters on the basis of analyzing the 3-D temperature field of this MCM in virtue of finite element thermal simulation technique, which involve the temperature on the ground boar of packaging, the conductivity factors of cementation layer, the material of base plate and the ground plate for packaging, the power density of chip and the outer circumstances.2. Has put forward six kinds of projects of thermal design for large power MCM by way of analyzing the temperature fields of MCM using the finite element thermal simulation technique step by step. These projects, which provide good references for improving the reliability and radiating performance of large-power MCM, include: (1) the improving of packaging parameters; (2) the adoption of radiating copper-pole and the copper radiator; (3) the improving of structure of copper radiator; (4) the direct water cooling; (5) the forced cooling of air convection; (6) the indirect water cooling. There-into, the projects (5) and (6) adopt the finite element simulation technique of thermal-fluid coupling.3. The thesis provides reliable data and methods for thermal analysis and design of MCM and has certain value of guidance and application.