Analysis Of Thermal And Mechanical Characteristics Based On RCP

Redistributed chip packaging is an innovative technology applied to chip package emerging recently. Compared with the traditional packaging technology, its characteristic of miniaturization caused by the redistribution layer rather than substrate brings it a significant role in promoting the development of multi-chip system, this packaging technology has attracted researchers around the world attention currently. However, as the chip package density increasing, the problem of heat dissipation and the package reliability problems caused by it has become one of the bottlenecks of this packaging technology.Numerical analysis method is a common method in the field of Engineering computation. In various kinds of numerical analysis methods, finite element analysis method can solve the issues of multi field coupling involved in this research most effectively and accurately, therefore, in this paper, using the finite element method for modeling and simulation of related. Relative to the set of heat transfer coefficient to simulate the convection cooling in the package thermal analysis of traditional, firstly, using power loading method, taking the heat dissipation power of silicon for load, by setting the air duct and air inlet flew conditions directly in the model, simulating the temperature of the chip package with forced convection. In the case of natural convection, the temperature field distribution in the model of RCP package built in this paper is calculated, the same as the change of the peak temperature in the package with Pb/Sn solder balls and Pb-free solder balls. In the wind under the 0~4m/s, the change of peak temperature and thermal resistance of the chip package is also calculated, and obtains the relationship curve related and the specific flow conditions are applied to meet the appropriate working temperature in the chip with different heat dissipation power.Based on the data calculated when makes analysis of the field of fluid and solid coupling by power loading method, taking the specific temperature values as load, characterizing various forced convection conditions comprehensively, simulates the thermal stress in RCP chip with different flow conditions. According to the results of this paper, the number of levels of the maximum stress value in RCP chip is 108 Pa. Under the condition of natural convection and wind velocity of 4m/s, the maximum stress values are respectively 564 MPa and 192 MPa. There is a certain improvement for thermal stress distribution when increasing the flow conditions.