.3 D-mcm Diamond Heat Sink Thermal Analysis And Thermal Stress Analysis

With the rapid development of integrate circuit and electronic products various packaging modes and packaging technologies are developed. Multi-Chip Module(MCM) packaging technologies rapidly develop because of it's characteristic of improving frequency and increasing transmission speed and so on. With increasing of packaging density and power, the technologies of cooling and heat dissipation and thermal stress become important problems to be resolved. In this paper the applications of diamond material to MCM to improve thermal characteristics and thermal stress problem are studied.In this paper outlining the characteristics of diamond substrate and problems to be faced with,and measures to be taken, introducing knowledge of multi-chips modules packaging.Introducing heat exchange theory and finite element theory, and deducing the theory that applies finite element method to thermal analysis and thermal stress analysis. Being based on actual multi-chips module packaging structure a three dimensional thermal analysis model is built, thermal analysis on multi-chips module is conducted using diamond substrate and thermal interfacial materials; a two dimensional and three dimensional chip-adhesive–substrate thermal stress model are built, and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip.Results in the paper will supply references to thermal designs of multi-chip module packaging based on diamond material.