Research And Implementation Of High - End Dual Interface Card Technology

This paper focuses on the research and realization of Dual Interface Card process and relativity。First of all, the general procedures of high level Dual Interface Card manufacture is introduced, which focuses on design enhancement and wafer process, package process, reliability test and etc..And each process has its own technical features, which is described in this paper.Secondly, although the Dual Interface Card related each process have already maturated and are widely adopted in the production of current Contact Card and Contactless Card. But there are still some technical drawback and obstacle for the Dual Interface Card process technology and manufacture. Hence all related process technologies can still not be directly applied to the Dual Interface Card.In general speaking, the whole dual interface card production has many technical problems, which covers Chip design, wafer process, module and card package and reliability verification etc. And two of the most important key technologies, are:the process relation between chip and module package, and the relation between module package and card package.This paper studies the aforementioned two key technologies and its implementation. And then proposes one feasible solution on the Dual Interface Card production, which is aligned with current production and no extra requirement, is needed. In addition, the proposed solution is applied in practical manufacture, which future proves the feasibility of the proposed solutions.