Research On Three-field-coupling Analysis For Electronic Equipments

There is universal phenomenon of the interaction among displacement, temperature and electromagnetic fields in the electronic equipment. In order to improve the all performance of device in the entirety, this paper needs to discuss the coupling theory and methods in the three-field interaction in the electronic device. For the characteristic, the paper presents the problem on electromagnetic field and temperature field on the impact of displacement, and the conclusion about three-field coupling analysis from the professional software. What the paper describes are:1.The common boundary of displacement field, electromagnetic field and fluid field is based on the structural surface, and also is the interactive boundary of electromagnetic and fluid field. In the process of numerical analysis, we get the surface grids of structure and reconstruct the common boundary of electromagnetic and fluid field that is easy to show the transformation exactly during the thermal and electromagnetic analysis. This paper solves the intricate difficulties such as grid distilling, grid reconfiguring, grid overlapping and grid matching during the displacement field transmission of coupling information.2.The paper gives the example on electromagnetic and thermal field in the influence of displacement which proves displacement field has the impact on electromagnetic and thermal field. It also discusses the result of leaking field intensity on the impact of slender slit resulting from structural vibration which obtains the conclusion the new slit from the structural oscillation enlarges the leaking field intensity and demonstrates the length of slit is the main factor of leaking, the width is little, neglected.3.It builds the optimized system on three-field coupling analysis, which enhances the integrated performance totally in the process of design and analysis of electronic device.