Research On Cold Plate Equivalent And Simulation & Optimization Of Three-field For Electronic Equipment

The structure of air-cold plate for electronic equipment is so slightly that it will take a lot of resources in thermal simulation and optimization process. However, the environment of electronic equipment is so complex when it works. Structural displacement field , temperature field (including the flow field) and electromagnetic fields interaction with each other when it works stabled. With the characteristics of electronic equipments, this paper summed up the equivalent formula of the cold air straight rib plate, developed a analysis and optimization platform of multi-field exclusively for electronic equipment. Main tasks are as follows:1. Developed a analysis and optimization platform of multi-field exclusively for electronic equipment. Describe the platform for design and the function of the thermal analysis module. Solved the key technologies such as structural deformation - thermal grid transfer.2. Use a group of Thermal Properties equivalent straight rib gas cold plate's effection of heat dissipation. In order to obtained the thermoresistance and flow resistance under any structure of a fin before numerical simulation.This paper derived the thermal resistance equivalent formula of straight rib gas cold cold plate through heat transfer equation and modified the current flow resistance equivalent formula. Compare simulation results between the actual model and the equivalent model with equivalent formula, and get reliable results. Optimized the cold plate fin arrangement in a cold plate cooling chassis. Significantly reduced the optimization time based on the premise that get reasonable results.3. Leads to the optimization model of three coupled field. Use the thermal simulation optimization module of the software platform with a typical Chassis. And compare experimental results and the simulation results. Verified the reliability of thermal simulation and optimization platform.