Thermal Design Of Components Placement Based On Three-Field-Coupling In Electronic Equipment

This paper presents fields and multi-field coupling in the electronic equipment. In terms of the characteristic of electronic device, it discusses the temperature field and electromagnetic field in the impact of structural displacement field, and how to transmit the displacement data of structural deformation to temperature and electromagnetic field. This paper describes the deformed displacement transmission of the structure-thermal problem through Delaunay triangulation, and the data of thermal- structure through Interpolation Methods from temperature to structural displacement. That is the way handling the bidirectional information transmission of thermal- structure.According to data transmission of multi-field coupling and the characteristic of thermal analysis and design in the high heat flux electronic equipment, the paper gives component placement optimization model based on information transmission of multi-field coupling for miniaturization and high-heat-flux of electronic components. This model is a placement problem, which is not only referred to thermal transfer, but also the structure and EMC. That is what is considered is how to make the components reasonable is the key problem of this paper.