Design And Analysis Of Cold Plate For Full Height Electronic Equipment

With the rapid development of electronic technology, electronic technology has been widely usedboth in military and civilian fields. People come to realize the importance of designs for electroniccomponents, thermal packaging and thermal through continuous practice, which also promotes thedevelopment of thermal control technology.This paper first introduces the general situation of development and the process of cooling of theelectronic equipment cooling technology, especially on the structural features of cold plate and thederivation of the heat transfer formula. Then the discussion focuses on the full height (from0to20kmabove sea level) cold plate design of electronic equipments. The design principles of cold plate areintroduced, and the physical parameters of the near space are analyzed. The physical thermalparameters, as well as the pressure loss coefficient, friction coefficient and heat transfer coefficient atthe entrance and exit are formula fitted by using orthogonal tests and regression analyses to get theapplicable formula. The results of programming calculation reveal how the factors influence theair-cooling type of cold plate’s performance through the altitude below20km. The influences ofheight, temperature and density on the performance of cold plate are studied both in standardcondition and extreme heat condition, which serve as reliable design bases for the full height coldplate design. Finally, the design process of the full height cold plate in standard condition is simulatedby Fluent, and the results of which are in high accordance with these obtained through programmingcalculation. The influence of rib structure on heat transfer performance is studied, and optimizationmethods are proposed through the analyses on the height, thickness and spacing of ribs.