Numerical Analysis Of The Electronic Component Cooling Within The Enclosure

With the rapid development of the electronic technology, electronic devices operate at high speed and high frequency, which resulting in a sharp increase in heat. Electronic devices become smaller, more integrated, more powerful, more responsive, which not only have higher requirements on the uniform temperature of high speed and high integration chip, but also on the heat sink itself to complete the increasing cooling requirements. In the course of the development of various computer components, the development pace of the chassis is much slower comparing to other hardware, but every change makes the chassis electronics layout more reasonable and the cooling effect more ideal. As the chip heat increasing, the heat problem in chassis get more and more attention. Optimizing the chassis structure is the most common method to improve the temperature distribution in chassis, what’s more,good distribution of electronic devices, add the ventilation holes and install additional fans can also effectively reduce the temperature inside the chassis, and improve the cooling effect. In this paper, we use numerical simulation methods to campare the cooling effect of emerging RTX chassis with the mainstream38degrees chassis, and study the temperature distribution during the forced air cooling process in chassis, providing a reference for chassis structure optimization. First establishing the chassis model according to the actual physical structure based on Flotherm software, and make numerical simulation on38degrees chassis to obtain heat distribution, and then simulate the heat distribution inside the RTX chassis,after comparing the results obtained the optimization. In addition, through simulating different position and number of air holes, different installing position and number of fans, and different type of radiator we can obtain heat distribution inside the RTX chassis. After comparing the results can obtained optimized condition.