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Study On The Optimization Of Single Parallel Microchannel Heat Sink Structure And The Heat Dissipation Performance

Posted on:2015-01-21Degree:MasterType:Thesis
Country:ChinaCandidate:Y J TangFull Text:PDF
GTID:2298330431476156Subject:Engineering Mechanics
Abstract/Summary:PDF Full Text Request
With the highly development of microelectronics technology, the chip of microscale, the high level of integration requirements also more and more high, and with the size of the chip is more and more small, cause the power density of chip has increased dramatically, making the heat flux of the chip is very large, the corresponding chip working temperature also increases. Based on the microscale heat transfer research of common structure of microchannel heat sink as the background, the thesis explores the structure size effects of the microchannel heat sink on the heat transfer performance.First of all, this research is under the constant heat flux boundary condition, in view of the rectangular microchannel in single-phase steady laminar fluid flow and heat transfer problems, and theoretically derived in rectangular microchannel fluid flow velocity and the analytical expression of the temperature distribution of general Nusselt number and the number of Poiseuille expression. And the calculated results show that the Nusselt number and the number of Poiseuille analytical solution derived was good consistent with the results of other literature.Secondly, to take advantage of biggest heat dissipation of microchannel heat sink, the trapezoidal and rectangular cross section of microchannel heat sink is optimized. Given the constant thermodynamic properties and hydraulic properties of all material, thermal resistance and pressure drop is objective function, and the structure size of microchannel is design variables. Using mathematical software MATLAB as a tool to optimize the structure size microchannel heat sink, the minimum thermal resistance and pressure drop of heat sink is gained.Finally, to test the heat dissipation performance of the microchannel structure, using the finite element method to simulate the process of chip cooling with the same condition of optimization. In order to prove that the optimized microchannel heat dissipation characteristic is better than that of those not optimized microchannel, in the process of numerical simulation, a non-optimized trapezoidal cross section and three kinds of rectangular cross section microchannels were chosen to compared with optimized microchannel. Comparison results show that the highest temperature and pressure drop of the optimized structure of microchannel heat sink is the smallest, which indicates that the heat dissipation performance of optimized structure of microchannel heat sink is better than that of without optimization.
Keywords/Search Tags:Microchannel heat sink, Thermal resistance, The pressure drop, Structureoptimization design, Microchannel numerical simulation
PDF Full Text Request
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