Research On Simple LED Die Bonder

LED die bonder is equipment with optical, mechanical and electronic integration. And it's key equipment during producing LED. Its performance makes great effect on the productivity and performance of LED. Except moving the LED frame into and out of the machine, simple LED die bonder can do the rest die bond job automatically. This function can meet the needs of small LED packaging firms.The research and development of this simple LED die bonder are finished by two persons, and this thesis includes the following aspects:(1) Research and design a chip ejected mechanism.Referring to the structure of current IC die bonder, design a simple and compact chip ejected structure of the simple LED die bonder. Then design and select all parts of the chip ejected mechanism, including eject pin mechanism and wafer movement mechanism.(2) Develop an image recognition system.The image recognition system is the key component of realizing the automation of LED die bonder as well as its difficult part. Its accuracy will influence the accuracy of LED die bonder. The image recognition is consisted of the image capture system, optical and illumination system, image pre-process and image matching functions.(3) Develop a library of image process and recognition.The library of image process and recognition includes three categories of functions: category of imaging card control, image process and image matching.This thesis will finish the design and assembly of chip ejected mechanism;develop a library of image process and recognition. And this library will be used by the LED die bonder control software.