Investigation On Thermal Management Of Graphene Applied To The Wide Band Gap Semiconductor Packaging

The wide band gap semiconductor has a very broad development and application prospect.However,it comes up with a higher requirement for packaging and cooling.In the semiconductor packaging structure,the heat generated by the chip is first reach to the substrate and the heat sink through the die attach material,and then to the external environment by the heat sink.Due to the small cooling area of the chip,the die attach material between the chip and the substrate becomes the cooling bottleneck.At the same time,it is also very important to bring the high heat out of the packaging system effectively.In this paper,a new type of die-attached material is developed,and the water-cooled cooling method of nanofluids is adopted to solve the dissipation problem of the wide band gap semiconductor packaging.The new die-attached material is three-dimensional graphene-copper-matrix composite material.The method of oxygen plasma surface treatment of graphene and electrodeposition of nano-copper particles is studied to enhance the thermal conductivity of graphene-nano-copper die attach composite material.Water-based graphene nanofluids were used as the medium for water cooling and heat dissipation.The influence of oxygen plasma on the thermal properties of graphene nanofluids was investigated and the mechanism was analyzed.It was discovered that the surface treatment of oxygen plasma successfully implanted oxygen-containing functional groups on graphene,which improved the wettability of graphene with aqueous solution.Uniform electrodeposition of copper nanoparticles on the surface of 3D graphene was promoted,which improved the interfacial heat transfer between graphene and copper.The method of electrochemical deposition of nano-copper particles can effectively enhance the heat transfer at the graphene-nano-copper interface,and improve the thermal conductivity of the sintered composite to 113.2W/m ? K,which is 166.7% higher than that of the pure sintered nano-copper material.At the same time,it was found that a small amount(0.375wt%)and small size(0.25cm?0.25cm)of 3D graphene was more conducive to enhancing the thermal conductivity of die attach materials.Meanwhile,oxygen plasma surface treatment improved the dispersion stability of graphene nanofluids,and the zeta potential reached-35.6m V.The thermal conductivity of nanofluids with graphene content of 0.1wt% increased to 0.92W/m�K,which was 50.8% higher than that of deionized water.Finally,the water-based graphene nanofluids were applied to the high-power LED heat dissipation to effectively ensure that the temperature of the LED remained stable as working,which was lower than the LED temperature of 25? without nanofluid heat dissipation.