Research About Quality Improvement In Semiconductor Packaging

Robust design is the product of the variation of performance during the manufacturing or use ofenvironmental variation is not sensitive, and products in its life cycle, regardless of its parameters, structureof drift or ageing (within a certain range, a design approach that would continue to work with satisfaction).In this way the design factors interfering with the guarantee of the product quality is stable, and can be usedfor inexpensive parts to be assembled. Therefore, is a robust design gives good stability, high performance,low cost design, features a performance integrated quality and cost optimization design methods. Robustdesign not only improves the quality and reliability of products, and reduced costs, have been widely usedin many areas of product design.Package hierarchy is a very easy encapsulation of defects, packaging, semiconductor devices used inthe process are likely to occur during the process. Plastic packaging, interface hierarchy is an importantaspect of reliability evaluation. Package design, choice of packaging materials, process parameters controland use of external environment, and they may lead to a package hierarchy. Therefore, in the currentcompetitive market conditions robust design methods are used to solve the semiconductor packaging underlayering issues is of great significance.This paper attempts to grasp the Taguchi robust design methods based on, trying to combine thequality function deployment (QFD), Six Sigma Management (6Sigma) from system design, parameterdesign and tolerance design of three phase stratification of semiconductor products. First of all, elaboratethe theory and methods of QFD,6Sigma. Subsequently, the QFD as the main line, collection of customervoice (VOC) design, manufacture and Assembly (DFMA), design failure mode and effects analysis(DFMEA), tolerance design and reliability design tools and methods, hierarchical problems insemiconductor packaging process, build failure analysis model. Finally, the use of robust design method tooptimize the design parameters and design parameters of the functional requirements of the mass loss andcontrolling costs are taken into account, establish a semiconductor layer quality improvement solutions.