Thermal Design Technique For ASIC

Application Specific Integrated Circuit(ASIC) is high-density tridimensional package technology. Along with the increase of package density, the issue of ASIC thermal failure has become more and more important. And the distribution of thermal stress is one of the primary factors. For the change of temperature field is the bottom of thermal stress field, it is necessary to get the distribution of temperature field before beginning the calculation of thermal stress field. Here the software ANSYS is applied to calculate the temperature field and the thermal stress field. At the end, this paper also discusses the influence to thermal stress field made by some components.If the thermal design of ASIC should be sound, it's needed to optimize all the main factors correlating the thermal design. In this thesis, the optimization of the distribution of IC chips is carried out. The program is developed with Visual C++language. A novel optimize method, Genetic Algorithms (GA), is used here.