Research On Thermal Stress In Laser Machining Of Quartz Microchannel

With the development of laser technology, laser drilling and cutting process of quartz glass has a huge advantage than the traditional processing method. In this paper, the temperature distribution and thermal stress field and thermal displacement in the interaction of laser and quartz glass have been calculated, provides a theoretical assistance for the later experiment.Based on the Fourier heat conduction equation, in this paper, the interaction of laser and silica is researched, the corresponding laser source function is established and discuss analytical solution of temperature field of each model. The one-dimensional heat conduction equation was processed by using finite difference method and the temperature distribution is calculated during continuous laser and pulsed laser irradiation. Considering the cumulative effects of heat, the cumulative effect of temperature inside the quartz is markedly enhanced with the increasing of reaction time. Temperature field analytical solution is calculated during Gaussian pulse irradiation, and the radial temperature distribution was simulated.Considering the thermal radiation and convection in the interaction of laser and quartz,the temperature distribution and thermal stress field have been calculated by using finite element method. The results show that laser parameters have a huge effect on the surface temperature. Based on the thermoelasticity and the temperature distribution, then the von Mises stress, radial stress and thermal displacement is calculated.