Analysis On Thermal Stress And Thermal Reliability Of BGA Packaging

Electronic equipment's invalidation usually related with the environmental temperature and working temperature, how to resolve the thermal reliability problem of thermal reliability has became one of the key technologies of micro-electronic package. Therefore, research on temperature distribution and thermal stress of micro-electronic package is very important, which has both theoretical and practical significance.The dissertation firstly built simple model of solder balls, using expressions deduced shearing strength of solder balls when the temperature rised,and built the basic model of BGA structure packaging by using ANSYS10.0. Considering the fact that chip could produce heat when it works, the dissertation simulated the temperature distribution of packaging, and used the temperature as a load on the packaging, analysed the thermal stress of it. To analyse the thermal reliability under abominable condition, the dissertation also analysed the thermal stress and thermal strain of packaging upon the temperature cycling condition which range from -55℃to +125℃, at last the dissertation predicted the fatigue life of packaging.