| Presently, there exists a need for totally implanted intelligent devices which are scaled to the dimensions of the anatomical analogues that they are to assist, measure, or replace. Size constraints prohibit the application of conventional encapsulation techniques of sealing in metal packages. A significant technological innovation in packaging technology can be achieved in the field of biomedical sciences by protective encapsulation in plasma polymers.;The long term objective of this research was to produce thin biocompatible polymer insulating materials specifically developed for use in the physiological environment. The methods of polymer formation by plasma polymerization and vacuum deposition technology were utilized to prepare surfaces, provide intermediate layers for composite film encapsulation, and produce functional hermetic encapsulated integrated circuits for the implantion environment.;Specifically, this research demonstrated that plasma reactor conditions optimized for adhesion can be combined with vapor deposition of xylylene polymers optimized for bulk dielectric properties, to produce improved dielectric properties in and reduce ionic leakage current through these biocompatible materials. Leakage currents were correlated with the ability of the materials to provide functional hermetic encapsulation of complimentary metal oxide semiconductor, CMOS, integrated circuits. Integrated circuits protected only by a plasma polymerized-vapor deposited organic film and totally submerged in saline functioned normally for over one year. |
