Research On Lean Six Sigma Management Of Product Quality Of L Semiconductor Company

With the heat flow of semiconductor industry developing,the semiconductor assembly and test industry in China is developing rapidly,L Semiconductor has always maintained good customer satisfaction with its high-quality products and services and competitive prices.However,when the company introduced a new production line,it encountered product quality problems caused by the crack at the bottom of the chip,resulting in a large number of product scrap losses,and may lead to products with potential failure risk into the hands of customers.The thesis analyzes the status of L company's quality management and lean six sigma management,and then elaborates how to improve L company's product quality management by using lean six sigma method.In the Define phase,introduce the project background: engineering department received a significant increase in the number of cracked die product quality feedback.Secondly,SIPOC flow chart was used to determine the scope of the project.According to the historical data,the project target was set to reduce the crack defect rate at the bottom of the chip,and the financial income was preliminarily calculated,which laid a foundation for the promotion of the whole project.In the Measure phase,the discrete data measurement system was analyzed for response Y and the measurement plan was made.In the Analysis phase,the influence factors causing the crack at the bottom of the chip are identified by the fishbone diagram method,and five main influence factors are finally determined by the C?E matrix tool and single factor verification: the bond head spring force,the bond head stuck,ejector pin plunge up speed,the overtravel of ejector pin motor,ejector pin timing.In the Improve phase,on the one hand,the equipment was reconstructed and upgraded for the problems of the bond head spring force,the bond head stuck and the overtravel of the ejector pin motor.On the other hand,the DOE was carried out for the influence factors of the ejector pin plunge up speed and the pick up force of the bond head.Through the fitting and calculation of the generalized linear model,the appropriate range of process parameters was finally determined.After evaluation,the actions show significant improvement effect,and the failure rate of cracked die is reduced to the zero,within project target.In the final Control phase,the optimized scheme and parameters were documented,which ensured the execution of the optimized scheme,consolidated the improvement results of the project,and brought financial and soft benefits to L Company.Thesis describes in detail the application of DMAIC LSS methods and tools in L Semiconductor Company to reduce the failure rate of cracked die and the results achieved,in order to provide a meaningful reference for other semiconductor enterprises to successfully promote lean six Sigma ideas and methods.