Design And Implementation Of Metal Based Circuit Substrate With High Thermal Conductivity

With the increasing power density of electronic products,the heat dissipation performance of circuit boards has become an essential factor affecting the performance of electronic products.Aluminum-based copper-clad laminate is currently the most extensively used material for heat dissipation printed circuit boards.Its core technology lies in the development of insulating dielectric layer composite materials with high thermal conductivity.The insulating dielectric layer composite materials were filled with multi-particle and multi-shape alumina,based on the composite of epoxy resin E20 and E44.Furthermore,we made a variety of heat conduction chains.Several aluminum-based copper-clad laminates with high thermal conductivity were produced based on the manufacturing process of aluminum-based copper-clad laminate and measured for their thermal conductivity,peel strength,withstand voltage performance,and heat resistance.Using liquid crystal epoxy to modify the epoxy resin matrix can improve the toughness and order of the resin matrix and improve the thermal conductivity,withstand voltage performance,and heat resistance of insulating dielectric layer composites.Still,the effect on peel strength is not very obvious.With the continuous increase of the alumina content,the insulating dielectric layer composite material's thermal conductivity shows an upward trend.When the alumina content is 83.3wt%,the thermal conductivity is as high as 2.43W/(m?K).However,too much filling will reduce the peel strength,voltage resistance,and heat resistance of the insulation dielectric layer.When the ratio of 10?m to 0.2?m spherical alumina is 4,the thermal conductivity,voltage resistance,and heat resistance of the insulating dielectric layer composite material are the highest;when the ratio of 10?m to 0.2?m spherical alumina is 3,the peel strength of the insulating dielectric layer composite material is the highest.The thermal chain has a noticeable effect on improving the insulating dielectric layer composite material's thermal conductivity,especially after adding large-particle BN and Al N to the thermal chain.When the filling amount is 82.8wt%,the thermal conductivity of the insulating dielectric layer can reach up to 2.83W/(m?K).Although the thermal chain significantly improves thermal conductivity,the experimental results show that the addition of the thermal chain reduces the peel strength and breakdown voltage and reduces the uniformity and cohesion.