Design And Development Of High Thermal Conductivity Circuit Board

The main research content of high thermal conductivity circuit board is to develop insulating layer with high thermal conductivity.In this paper,nano boron nitride is positioned on long-chain resin to create a heat conduction network chain,and filled with particles of different sizes to form a three-dimensional heat conduction path,effectively improving the thermal conductivity of the insulation layer.And this paper tests and analyzes the thermal conductivity,peeling strength and voltage breakdown strength of the aluminum-based copper clad laminate.?1?The types of inorganic heat conducting particles are BN of 100nm,200nm and 300nm,Al₂O₃ of3?m and 5?m,Al N of 1?m and 3?m.When filling a particle size particle and the filling amount is 160g,the 100nm BN group had the highest thermal conductivity and the thermal conductivity of the insulating layer reached 1.57W/m·K.?2?The experimental show that the thermal conductivity of the combination of particles of two particle sizes is better than that of single particle size.When the filled amount reached 160g and300nm BN:1?m Al N=1:8,the thermal conductivity of the insulating layer reached 1.69W/m·K.?3?The thermal conductivity of the insulating layer is different due to the difference in particle size,particle size ratio level and filling amount of the thermally conductive particles.The experimental show that when the ratio of the three particle sizes is 300nm BN:1?m Al N:5?m Al₂O₃=1:3:6 and the filled amount reached 160g,the thermal conductivity of the insulating layer reached 1.82W/m·K.?4?When the 300nm BN:1?m Al N:5?m Al₂O₃=1:3:6,the resin selected for the E44,E12,E03,Phenoxy resin?PR?,Polyphenylene oxide resin?PPR?complex.The experimental show that when E12:PPR=3:1,the thermal conductivity of the insulating layer reaches 1.87W/m·K;when E12:E03:PPR=2:1:1,the thermal conductivity of the insulating layer reaches 1.91W/m·K.?5?The Connection reagent serves as an intermediate medium for locating boron nitride.When EP:300nm BN:1?m Al N:5?m Al₂O₃=1.78:1:3:6,the resin ratio is E12:E03:PPR=2:1:1,and the Connection reagent is 1.2g,The thermal conductivity of the insulating layer reaches 2.8W/m·K.And explore the influence of the thermal conductivity network chain formed by nano-sized boron nitride with different particle size on the thermal conductivity of the insulating layer.The experimental results show that the small particle size boron nitride is conducive to the formation of thermal conductivity network chain,when 100nm BN:200nm BN=2:1,The thermal conductivity of the insulating layer reaches 2.96W/m·K.?6?With the increase of the proportion of thermal conductive particles,the thermal conductivity of insulating layer first increases and then decreases,and the critical point is 80.7%.?7?The size and ratio of the resonant particles,the thickness of the insulating layer and external factors all have an impact on the breakdown voltage of the aluminum-based copper clad laminate.When filled with 100nm BN of 100g,the breakdown voltage reaches a maximum value of 50k V/mm,and the breakdown voltage strength continues to increase with the increase of the thickness of the insulating layer;the types and proportions of resins and external influencing factors affect the aluminum-based copper clad laminate is an impact on the peeling strength.When the filled amount of thermal conductive particles is 100g,E44:E12=1:1,the peeling strength can reach 1.64N/mm.