Study On PTFE Based High Frequency Copper Clad Laminate Applied In 5G Communication

2019 is the first year of 5G,and 5G is officially put into commercial use.5G marks the use of higher-frequency electromagnetic waves,the emergence of millimeter-wave autonomous driving,and the interconnection of all things.These highly integrated and high-performance electronic technologies require high-frequency,high-speed,and large-capacity electronic materials and electronic components The functions of storing and transmitting signals require lower latency,and 5G communication can perfectly fulfill the above requirements.PTFE(polytetrafluoroethylene)high-frequency copper clad laminates just meet these requirements.Therefore,this article will focus on the performance of PTFE-based high-frequency copper clad laminates.High frequency copper clad laminate is an important foundation for 5G development.In 4G and previous generations of communication,the frequency of the signals used is low.Therefore,in electronic equipment,the FR-4(epoxy glass cloth laminate)copper clad laminate made of ordinary resin materials as the dielectric layer fully meets the needs.However,with the development of 5G,higher frequency signals are needed,and the higher the frequency,the greater the propagation of the same distance,the greater the signal loss,so the high frequency copper clad laminates used must have very small dielectric losses.This article mainly introduces some raw materials used in high-frequency copper clad laminates and some important production processes.The effect of FEP(perfluoroethylene propylene copolymer)content on the content of PTFE-based high-frequency copper-clad laminate and the amount of prepreg immersed in the same number of prepregs was studied.The FEP content also affects the copper foil peel strength of the copper clad laminate.When the dielectric layer does not contain FEP,the copper foil peel strength is the smallest.The content of FEP will also affect the dielectric constant(Dk)and dielectric loss(Df)of the copper foil dielectric layer.With the increase of FEP content,the dielectric constant and dielectric loss will increase with the increase of FEP content Not bigger is better.In addition,this paper also studies the effect of PFA(soluble polytetrafluoroethylene)film on the adhesion between PTFE sheet and copper foil,that is,the relationship between the thickness of PFA film and the peel strength of copper foil.The experimental results show that,and It is not that the thicker the PFA film,the better,but that it will maximize the peel strength of the copper foil at a certain thickness.In order to solve the problem that a lot of heat will be generated when using high-power electrical equipment,the thermal conductivity of the copper clad laminate must be increased to export the generated heat in time,which proves that it is safe to use,so the thermal conductivity of the copper clad laminate is increased by adding nano-ceramic particles.Fiberglass cloth and glass mat are both used as reinforcement materials for the dielectric layer of copper clad laminates.When used in the production of copper clad laminates,the same amount of immersion in the same emulsion will have different glue content,but also because of porosity The reason for the impact on the dielectric properties.The general process of manufacturing copper clad laminates in the industry is to use process production first,and then test the parameters.This parameter is also fixed,but it is impossible to make specific parameters of the copper clad laminates through theoretical calculations.This paper gives a theoretical model,predicts some parameters of copper clad laminates by the ratio of raw materials,including dielectric properties and other parameters,and compares the theoretical prediction errors through specific tests,which can have great guiding significance for industrial production.The development of 5G is not only an increase in signal frequency,but more importantly,the development of advanced materials.The development of advanced materials is the foundation of high-tech development.Therefore,the development of 5G,high-frequency copper clad laminate is crucial.Through research,I hope to make my own contribution to the development of 5G.