Study On The High Power LED With High Thermal Conductivity Aluminum Copper Clad

This paper puts forward a preparation method of alumina based copper clad laminates by micro-arc oxidation technology. Establishing a High-power LED equivalent thermal model, and carries on the ANSYS finite element analysis of steady state thermal analysis, the simulation results show that the packaging structure of micro arc oxidation ceramic coating has better heat dissipation performance.Through the analysis of micro arc oxidation coating on aluminum based view of morphology, film thickness, roughness, density variation rules of different micro arc oxidation process parameters on heat conduction layer, insulation and adhesion. Compared with phosphate, aluminate system, silicate electrolyte system with the concentration of Na2SiO3 of 6 g·L-1, KOH concentration of g·L-1, EDTA-2Na concentration of 2 g·L-1 has better insulation and film forming efficiency. Affected by the film thickness and porosity, the coefficient of thermal conductivity is the largest when termination voltage of 380 V. According to the test results, considering the film growth rate, insulating properties, thermal conductivity and other factors, we select the best duty cycle is 15%. As the frequency increases, the film thickness decreases, the density increases, the insulation resistance and breakdown voltage also increases, and the best frequency is 1000 Hz.The film thickness and roughness was increased along with the processing time, and appeared the crack of in 30 minutes, when they was under different micro-arc oxidation treatment time. According to the test results, the changing rule of thermal conductivity is λ30>λ20>λ10>λ45. In this experiment, 30 min was chosen for the best treatment time.