Design And Realization Of High Frequency And High Thermal Conductivity Electric Subgrade Board

With the development of electronic information technology in high frequency,high speed,and high integration,the performance requirements of copper clad laminate are getting higher and higher.These properties are mainly manifested in dielectric constant,dielectric loss,and thermal conductivity.Ordinary copper clad laminate cannot meet the needs of high-end electronic products due to the shortcomings of high dielectric constant,large dielectric loss,and poor heat dissipation.Therefore,the development of high frequency and high thermal conductivity copper clad laminate has essential research significance.This article starts from the preparation process of the copper clad laminate,introduces the performance of the selected primary raw materials.Dicyclopentadiene phenol epoxy resin(DCPDEP),biphenyl liquid crystal epoxy resin,and bisphenol A dicyanate ester resin(BADCy)are used in the matrix resin,with hexagonal boron nitride and silicon powder are used as filler.The surface of the filler is modified with a silane coupling agent,and the colloid is toughened with maleic anhydride polybutadiene(MLPB).The formulas of different components were designed,and the copper clad laminates were prepared according to the specific experimental procedures.And the copper clad laminate was tested for dielectric properties,thermal conductivity,peel strength,voltage withstand strength and heat resistance.Finally,the influence of DCPDEP,liquid crystal epoxy resin,and total filler filling on these five properties was analyzed.The results show that:(1)DCPDEP can improve the dielectric property of the composite system.When the content of DCPDEP is 23wt%,the dielectric performance is the best,the thermal conductivity is the largest,and both the withstand voltage test and the heat resistance test are qualified,but the peel strength is minimal.(2)Liquid crystal epoxy resin can improve thermal conductivity and has little effect on the peel strength.The influence on dielectric properties is small,and there is no regularity.Due to the rigid structure,heat resistance is promoted to a certain extent.The voltage strength test also passed.(3)The addition of filler is mainly to improve the composite system's mechanical property and thermal conductivity and provide insulation,support,and thermal conductivity for the copper clad laminate.With the gradual increase of the filler content,the thermal conductivity gradually increases,and the withstand voltage strength test is also qualified.Since the filler used has high-temperature resistance,it also promotes heat resistance to a certain extent.When the filler content is 55wt%,the thermal conductivity is the largest,reaching1.19W/(m·K).However,too high a filling amount will reduce the peel strength.From the performance test and analysis of the copper clad laminate,it can be known that the prepared high frequency and high thermal conductivity copper clad laminate has a low dielectric constant,low dielectric loss,high thermal conductivity,and good overall performance.It meets the basic requirements of the copper clad laminate.