Preparation And Performance Study Of High Thermal Conductivity And High Frequency Copper Clad Laminates

The development of electronic products has imposed stricter requirements on the performance of copper clad laminate: lower dielectric constant and smaller dielectric loss,ensuring the speed and quality of signal transmission,higher thermal conductivity,reducing heat accumulation,higher peel strength,higher breakdown voltage and better heat resistance,which requires the performance of copper clad laminate to be improved.In this paper,dicyclopentadiene phenol-type epoxy resin(DCPDEP)and bisphenol A-type cyanate resin(CE)were used as matrix resin,hexagonal boron nitride(BN)and spherical silicon micropowder were used as thermally conductive filler,some polybutadiene(MLPB)toughening agents and silane coupling agents were added to prepare high-temperature and high-frequency copper clad laminate by rolling,hot pressing and other processes.(1)Study different semi-curing conditions.The results showed that when the semi-curing time was 6 minutes,the amount of imidazole was 0.4% of the mass of the matrix resin and the semi-curing temperature was between 145°C and 150°C,the degree of semi-curing was more suitable,and there would be no flow of glue or uneven phenomenon in the preparation process.(2)Add different DCPDEP: CE ratios.The results showed that when the ratio of CE: DCPDEP was 1:1,the dielectric property of the copper clad laminate was relatively good,but the semi-curing time took 12 minutes,and the cost was too high in the actual preparation process.Comprehensive consideration,the ratio of DCPDEP: CE was 7:3,the semi-curing time took 6 minutes,the dielectric constant of the prepared copper clad laminate at 10 MHz was 3.49 and the dielectric loss was 0.0059.(3)Add silicon micropowder filler with a particle size of 4.5?m and BN filler with a particle size of 3?m.The results showed that when the filling amount was increased,the thermal conductivity was increased,but dielectric property and the peel strength were deteriorated.(4)Study the effect of the amount of coupling agent and MLPB toughening agents on the performance of copper clad laminate.The results showed that when the coupling agent was 0.4% of the total mass and the MLPB was 6% of the total mass,the thermal conductivity of the copper clad laminate was the highest,reaching 1.25 W/(m.k),the dielectric constant at 10 MHz was 3.61,and the dielectric loss was 0.0066,the peel strength was 0.6 N/mm.(5)Test the heat resistance and breakdown voltage.The results showed that the breakdown voltage was relatively good,reached more than 30 k V/mm,and the heat resistance was relatively good.There was no delamination or blistering in the tin furnace at 288°C for 30 seconds,all of which met the basic requirements of copper clad laminate.