Application Research Of A New Audio Interface SoundWire On Baseband Chip

With the advent of the 5G communication era,mobile communication protocols have undergone rapidly development and continuous updates,with increasingly higher communication quality and faster communication speeds.The baseband chip is the communication protocol processing core of the mobile communication device,and is mainly responsible for communication protocol conversion and data transmission.Among them,the processing and transmission of audio data are the key factors that determine the quality and speed of 5G communication.With the rapidly development of multimedia technology,researchers have proposed a variety of audio protocols,and interface circuits designed for these audio protocols have been integrated into baseband chips.Therefore,how to develop corresponding audio interface circuits and integrate them into audio systems according to the new audio protocol is the focus of multimedia technology research and baseband chip development.This paper focuses on the audio subsystem in the 5G baseband chip of the Intel company,and conducts in-depth research on the first application of a new audio interface protocol Sound Wire in the baseband chip.The audio subsystem is the core system for the baseband chip to collect,process and transmit audio data during the call.It’s core module,the digital signal processing chip(DSP),is responsible for processing audio data,and the digital audio interface circuit between the external system and the DSP not only directly affect the performance of the entire system,and standardized data transmission structure greatly improves the universality of the system.Compared with other audio protocols,because Sound Wire has more complex protocol structure,stronger extensibility,more comprehensive functions,etc.,the integrated implementation is more complicated.This paper delves into the protocol requirements of Sound Wire,and the structural and functional requirements of the audio subsystem.Then do integrated design with Sound Wire IP.Including multi-module register transfer level(RTL)digital circuit planning and design,combining module-level design with systemon chip(So C)level design,ensuring data processing functions and improving system-level interaction.Due to the characteristics of high-speed interface circuit data transmission across clock domains,complex interface circuit design problems such as cross-clock domain transmission and asynchronous clockdeviation are solved by optimizing the circuit design.At the same time,in order to meet the low power consumption requirements,multiple low power consumption methods are inserted in the design process to reduce system power consumption.This paper realized the data transmission function required by the new protocol through the RTL integrated design,and ensured the good communication between the interface circuit and the audio subsystem,and completed the key steps from the protocol to the circuit implementation.The realization of the new audio interface circuit greatly improves the audio data diversified transmission capability of the baseband chip.After the integrated design is completed,this paper builds a reusable verification platform based on the universal verification methodology(UVM),develops a new verification intellectual property core(VIP)for Sound Wire,and performs multi-scenario,multifunctional system-level verification of the entire interface circuit to ensure the normal operation of the interface circuit.At the same time,during the verification process,through the writing and optimization of multiple testcases,the coverage rate reached 100%,ensuring the completeness and inheritability of the verification.After verification,the power consumption parameters of the entire interface circuit are measured,and the design is reoptimized according to the parameters,which reduces the circuit power consumption by more than 50%,and the integrated design is more in line with requirements and higher quality.In summary,this paper has completed the design and verification of the Sound Wire audio interface circuit,and successfully applied it to the baseband chip and taped.Due to the Sound Wire audio protocol is very novel and has broad application prospects,the interface research for this audio protocol has more practical and urgent engineering needs and foresight.