Evaluation of materials and process development for the structural integration of passive electronic components

Many different methods of reducing the size of electronic packages have been developed over time. A recent example of this is the Multiple Chip Module-Laminate (MCM-L) which consists of several layers of thermoset polymer, metallized in a pattern that connects the various components (chips) attached to the laminate surface, to an electronic circuit. The more complex a circuit becomes, the more components must be attached, which increases the surface area of the laminate substrate (board).; Processes have been developed to integrate two kinds of the least complex components: resistors and capacitors, known as passive components, into the laminate structure of the MCM-L to increase its density and thereby decrease its volume. The resistor integration process was successful for 75% of the components integrated. The capacitor integration process developed both a material of high dielectric constant (35), and a means for plating copper to both sides of a 0.2 mm thick sheet of this material, creating an ultra-thin, parallel plate capacitor.