Research On Electromagnetic Compatibility Of System-In-package(SIP) And PCB Board-level

In order to meet the demand of electronic equipment to be thin,portable and miniaturized,System-In-Package(SIP)technology emerges at the right moment,and PCB Board-level design is also gradually showing the development trend of high density and high speed.At the same time,the problem of Electromagnetic Compatibility(EMC)caused by the increasing output power and decreasing supply voltage of integrated circuit chips becomes more and more serious,and the mutual influence and restriction between SI/PI/EMI become more prominent.Whether it is System-In-Package(SIP)design or PCB Board-level layout routing,the success rate of the design can no longer be guaranteed by the designer's experience.Therefore,the EMC analysis on package design and PCB Board-level design becomes more important in the initial stage of product design,which can greatly improve the success rate of product design,shorten the research and development cycle and reduce the cost of development.This paper conducts an in-depth study on the EMC risks faced by System-In-Package and PCB board-level,the analysis method and simulation process of EMC of System-In-Package and PCB board-level are determined through theoretical analysis and simulation verification.The research idea is as follows: Firstly,the SI/PI problems of System-In-Package and PCB Board-level are studied.Then,the restriction and influence of SI/PI performance on EMC are analyzed based on the research results of SI/PI.At last,the thoughts and process of EMC simulation for electronic equipment are given with an example of the practical engineering.The main research contents and results are as follows:(1)Studied the transmission characteristics of the System-In-Package interconnection channel.The model of local Package interconnection channel was established to explore the influence of the Bonding height and diameter inside the system-level encapsulation on the signal transmission characteristics.When the Bonding span is the same,the smaller the bonding line height and the larger the diameter,the better the transmission quality of the System-In-Package encapsulation interconnection channel will be.A method of crosstalk simulation for complete encapsulated interconnection channels is proposed.(2)Research on the characteristics of complete Power Delivery Network(PDN)and decoupling network design.The theoretical model and simulation model of power/ground plane structure were established respectively to study the influence of power/ground plane size and medium thickness on the performance of PDN.The frequency characteristic and parallel characteristic of decoupling capacitance are analyzed,and the method of designing decoupling network is given.The connection characteristics of capacitor are discussed in detail.By studying the PDN characteristics and decoupling network design,the design method to ensure the PI is obtained.(3)Based on the analysis results of SI and PI,the influence of SI/PI performance on EMI is studied.A PCB model with different quality of signal transmission system and different thickness of medium between power supply/ground plane is established.The simulation results show that better signal transmission quality and PDN performance can reduce the EMI of equipment.(4)The EMC analysis is to better serve the product design,this paper finally takes the actual engineering design as an example,and gives a method of EMC simulation of the whole electronic equipment system by combining all levels of packaging.It includes PCB Boardlevel SI/PI/EMI simulation,chassis structure shielding effectiveness simulation,PCBStructure joint simulation and Package-PCB joint simulation.The EMC performance of the electronic equipment is improved by simulation and optimization.