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Electromagnetic Collaborative Design Of PCB

Posted on:2014-08-14Degree:MasterType:Thesis
Country:ChinaCandidate:G Y YangFull Text:PDF
GTID:2268330425466780Subject:Communication and Information System
Abstract/Summary:PDF Full Text Request
Among all the electronic products, Printed Circuit Board(PCB)is the most fundamentalcomponent, and also the carrier of the majority of electronic components. With the rapiddevelopment of electronic technology and consumer’s requirements for the intelligent andminiaturization of electronic products, the integration level of PCB becomes more and moreintensive. The design of PCB, to a great extent, affects the interference and anti-interferenceability of circuits. In order to obtain fine performance of electronic circuits, besidesreasonable selection of circuit components and circuit design, better PCB design is also veryimportant. Thus the resulting signal integrity, power integrity, electromagnetic compatibilityand other issues in high-speed circuit design, have become an unavoidable problem in modernelectronic design. The more consideration of signal integrity, power integrity, electromagneticcompatibility in the process of PCB, will not add an additional cost. Therefore, it is necessaryto conduct a thorough research in signal integrity and other issues of PCB design.High-speed PCB design mainly includes three parts: first is the signal integrity design,then is the power integrity design, the last is the electromagnetic compatibility design. Thispaper, starting with the three parts, is based on theoretical research, with software simulationanalysis, finally research and analysis on issues of high speed PCB design can be carried out.This paper is mainly consisted of the following aspects:1. According to the current research status of modern high-speed circuit design, thehigh-speed circuit design has been divided into three parts: signal integrity, power integrityand electromagnetic compatibility, and the idea of collaborative design for high-speed circuitsPCB from signal integrity, power integrity and EMC has been elaborated.2. The theory of signal integrity, power integrity and electromagnetic compatibility hasbeen studied, and the key factors affecting them have been simulated and analyzed by EDA,combining theory analysis and simulation results, the root causes of problems has been found,and combining with engineering practice, the restraining measures have been summarized,which provide a theoretical reference to the actual PCB design.3. Using EDA tool, an actual PCB was collaborative designed with signal integrity,power integrity and electromagnetic compatibility. The nets where the problems occurredeasily were analyzed through pre-layout simulation, and rules have been made to drive thedesign based on the simulation result. By the post-layout simulation, the PCB design has been validated and optimized, it proved that the PCB design of this system can satisfy therequirements, which verified the collaborative designed with signal integrity, power integrityand electromagnetic compatibility is very important and effective in the high-speed circuit.
Keywords/Search Tags:Signal Integrity, Power Integrity, Electromagnetic Compatibility, Printed CircuitBoard, Simulation
PDF Full Text Request
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