The Design And Implementation Of General SiP Chip Test System

With the rapid development of China's integrated circuit industry and semiconductor technology level,each circuit module can be continuously integrated on the same chip,making the complexity and integration of the chip composition higher and higher.However,the development of chip design and manufacturing depend on the chip test.So whether the performance of the chip can be tested quickly and accurately is directly related to the development trend of the integrated circuit industry.But current chip test systems have many limitations and cannot meet the requirements for implementing tests for specific types of chips.The above limitations include single chip test,poor communication stability,single test method,deficient error feedback mechanism and high cost.Therefore,it is necessary to design a chip test system with high efficiency,high stability and low system upgrade cost.The project combines embedded technology with C#programming language.According to the SiP chip test system,the project studies the overall scheme design and testing methods deeply.The main research includes the following parts:the general SiP chip test system consists of TI6713 chip,SiP chip,ARM,host computer and expansion module.1.Application management PC platform adopts C#object-oriented programming language design,and asynchronous call and multi-threaded way to execute threads of data received,data stored and data displayed independently.For host computer platform,the Ethernet test is primary;while serial port test is secondary;the serial port test mainly resorts the serial port assistant to complete the system test of the underlying chip;the Ethernet test uses the socket object based on TCP/IP protocol to realize the communication and finish system test of the underlying chip.The host computer platform sets the background monitoring mechanism to record the test information.And the host computer platform sets the test process in human-machine interface to grasp the test results in time,and uses various test modes such as single item,comprehensive,automatic,etc.to improve the test accuracy.At the same time,the reserved chip expansion module facilitate the expansion of post-product functions and emergency standby.2.The dispatching transport layer uses SPI communication to complete the data exchange between ARM and the underlying chip.With the bridge function of ARM,the Ethernet communication is completed and the data exchange between the underlying chip and the host computer is realized.In the meantime,the communication is more stabilized by the secondary verification of ARM.3.The test execution layer makes use of CCS software to complete the unit test and module test of all the underlying chips.The dual-port RAM is used to realize the communication between the underlying chips and finally complete the chip performance test.In the end,it is possible to test and screen different types of self-developed chips through the general SiP chip test system,and reduce the development cost.Making use of ARM's secondary check mechanism and multiple test modes of the host computer improves test stability and test accuracy;The background monitoring mechanism makes it easy for testers to grasps test information in real time.Serial port and Ethernet test mode improve the practicability and market value of the test system.