Research And Development Of 6C Process Based On MicroSIM And NanoSIM Cards

In nowadays,science and economic is in high develop,together with which that smart card industry also in a high develop era.Recent years,main product for our industry is MircroSIM and NanoSIM instead of StandardSIM,and its combo card and trio card.New SIM card can bring us big benefit,but it also take some problems to us,such like internal unit broken lead to function fail,plug force low lead to small card fall,these make up for the main problem of industry,find solution to solve them is the main point of this paper.In the beginning of this paper we do introduce to the SIM card and IC card's definition,constitution,theory and process,and then around the MicroSIM and NanoSIM card,we discuss about the combo card and trio card's process and produce characteristic,and think about the main problem may exist in these process,take some suggestion for them.According to the two problem encountered in the new process of 6C,we found the root cause and make improvement.For the function fail caused by the internal unit broken,we know the root cause is external force lead to the wire broken and then module function fail,for this,we design a hollow out mold for it,can make the internal unit broken rate decrease much.For the low plug force issue,we made a DOE matrix,through it and the analysis of the data,we found that the root cause is the frictional force too low to burden the 3FF and 4FF card.For this,we design a adding-leg mold,which can enlarge the plug force and solve this problem.Above two new design mold after implemented to the production line,we found result is positive,these can solve the main problem in smart card industry,improve the perso yield from 98.5% to 99.5%,and small card drop problem totally solved.