Structural Releasing And Shaping Techology Of Silicon Microchannel Array

Structure release technology and plastic technology are two important process of silicon microchannel preparation,which is the primary research object of this paper.The back collapse phenomenon of silicon microchannel array was found from the wet etching structure release experiment.By observing surface morphology change of the experiment,it is concluded that the back collapse phenomenon is caused by the uneven corrosion,and there is a certain relationship with the crystal orientation.The error which is the thickness of releasing chemical mechanical polishing method silicon microchannel array was analyzed and improved.Then the experiment adjust temperature and concentration of corrosive liquid to control channel morphology effectively.Through the control of the concentration of isopropyl alcohol to reduce the time that required for the plastic experiments,from roughly 5 hours shortened to 3 hours.Meanwhile which analyzed the uniformity of size of silicon microchannel experiment.