The Thermomechanical Analysis Of LTCC Welding Module And Optimization Of Reflow Oven Interface

In recent years, with the popularity of smart phones, various products with built-in LTCC module also come into people's horizons. LTCC modules often appear warping phenomenon in reflow welding production process. Then the modules turn into a tortoise shell-with high middle part and low sides. After reflow soldering, a lot of tiny cracks appear in the edge parts of LTCC substrate. This may lead to high failure rate. This paper explores the causes of these phenomena and adjusts the structure of LTCC module to improve the quality of reflow soldering. In order to facilitate the operators to operate reflow furnace and improve the quality of reflow soldering, the article also improved the original interface of reflow furnace.In order to explore the warping deformation of LTCC module and local stress concentration of LTCC substrate, LTCC module coupled thermo-mechanical analysis model was established based on the three-dimensional modeling software and finite element analysis software. We found out the cause of the LTCC substrate crack and module warp through the coupled thermo-mechanical analysis. Several structural optimization schemes were proposed to reduce the tensile stress in the substrate and reduce module warp after repeated simulation. Put forward to increase parts stiffness (add the rung, increasing the thickness of the shell, and increase the LTCC substrate thickness), using thermal matching material as minimize the buckling deformation of the LTCC module solution. Put forward the optimization of LTCC fillet size, using thermal matching materials, increase the LTCC substrate thickness and ease the LTCC substrate stress concentration of the solution.In order to optimize the original surface of reflow oven, we researched the reflow furnace interface users and analyzed the original interface in many aspects. Analysis shows that there were some problems of the original interface such as inflexible layout, dark colors, slender fonts and mixed icons. Learning from these defects, this paper put forward comprehensive design including layout design, color design, font design and icon design based on the principles of beautiful, friendly, easy to operate and so on. This paper also designed the eye movement experiment and contrast subjects respectively before and after improvement "parameter Settings area" in the user interface of the search the efficiency of information. Analysis combining eye movement index such as task accuracy, the interest area first time, fixation point number, numerical used search time, scanning path graph and hot figure indicated that the optimized user interface was more effective.The presented optimization of LTCC module reflow soldering process warp and substrate stress concentration problem method and optimization design by the interface has certain engineering application value.