Research On Reliability Prediction And Test Method Based On Physics Of Failure Of Electronic Products

The development cycle of electronic products is decreased rapidly, while lots of new technologies are applied, leading to a higher and higher reliability requirement. A huge challenge is occurred to the electronic product reliability design. At present domestic electronic products reliability mainly adopts the ‘after verification’ method of, focusing on the statistical rule of fault analysis and validation, it is difficult to support the design of highly reliable products. In recent years, the failure physics method has attracted much attention in the reliability engineering, which based on the reliability of the failure physics from failure reason and mechanism of failure law of research products. The failure physics method use the mechanism and rules for fault diagnosis and repair, prevention, prediction, and then guide the reliability design, analysis and verification related activities, such as, playing an increasingly important role in electronic equipment development. Combining with the characteristics of high reliability electronic products, consummates the reliability prediction and test method based on failure physics, to early in the design of the product failure is expected, so as to ‘prevention’ measures to guide the design of the product. This paper mainly contains the following contents:(1) Electronics reliability prediction method and process is consummated based on failure physics. The connotation and denotation of product failure are studied from a narrow sense and a broad level, and then study the failure process of electronic products. On this basis, we develop the theory of reliability based on failure physics, and put forward the reliability prediction based on failure physics processes.(2) The reliability simulation and analysis method of the electronic product is consummated based on fault mechanism model. The reliability simulation and analysis process is proposed based on fault mechanism model of electronic products, including the electronic product CAD model and it’s simplified method, the CFD modeling and thermal analysis method, the FEA model and vibration analysis method. The common failure mechanism and failure mechanism of the electronic product model are discussed, and the stress damage analysis method of electronic products is studied.(3) The function of electronic circuit fault simulation method is consummated. The research contents the circuit fault simulation analysis process, the system function model modeling method, the fault injection method and the simulation methods of FMEA, which formed a complete set of electronic circuit function failure simulation analysis method.(4) Using a certain type of aircraft’s controller computer equipment(FCU) as an engineering application, to verify the reliability prediction method based on failure physics. By the reliability model based on fault mechanism simulation test and fault simulation test, electronic products function weak links are found. And the reliability of the product is improved, by guiding the structure reliability design and circuit function reliability design, finally the correctness of the proposed method is verified.