Reliability Analysis Of Multi-chip Module Based On Physics Of Failure

Multi-chip module packing technology has been widely applied in the electronics industry,it is an effective way to achieve efficient operation of electronic system and equipment miniaturization,it also can play the excellent performance of semiconductor device IC.But the reliability analysis of multi-chip module is special on its own because its complex structure and different service environment,so the research method has important meaning to ensure the quality of multi-chip module on the whole life cycle.Under normal operating conditions,multi-chip modules have different tasks in the life cycle,its environmental load and stress are also different.Based on the experience of related projects,this paper considers the actual design and environmental load conditions of multi-chip modules,and analyzes the reliability of multi-chip modules from the viewpoint of physical failure,and does the research of life prediction and reliability of multi-chip modules based on physics of failure analysis method.The main contents are as follows:First of all,taking into account the characteristics of multi-chip module package,this paper will introduce the effect of failure of each module on overall reliability from the physical and chemical aspects according to the different aspects of multi-chip module,and reveal its failure mechanism and failure mode features.On the basis of this,study the failure mechanism of multi-chip module under different task profiles and different stress profiles,and consider the internal factors such as design,material and process which affect the inherent reliability of multi-chip modules.It also build the technology framework to solve the life prediction problem of multi-chip module,combined with finite element analysis of multi-chip modules to simulate the actual working conditions to complete the finite element analysis under the thermal cycle under.Aiming at the typical failure mode of multi-chip component solder joint failure,the life prediction model will be analyzed and the life prediction under thermal cycling will be carried out by finite element method.Secondly,based on the analysis of the failure modes of multi-chip module at home and abroad,a competitive failure model is established to describe the relationship between over-stress failure and loss failure of multi-chip modules.In order to study the correlation between failure modes,a joint distribution model of multiple lognormal distribution functions is established,and the correlation hypothesis test is carried out.The correlation coefficient is obtained by using the correlation coefficient to describe the correlation between failure modes.Finally,the accelerated life test of multi-chip module is studied on the basis of physical of failure analysis.This paper analyzes the advantages and disadvantages of three kinds of accelerated life methods,and establishes an improved accelerated life test based on the actual working conditions and reliability of multi-chip modules.And determine the stress of the accelerated life test and its application mode.Finally,the reliability statistical analysis is carried out.