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Research Of Technology For Upgrading The Structure Ofspreading Knife For Silicon Crystal Processing

Posted on:2014-07-31Degree:MasterType:Thesis
Country:ChinaCandidate:D Y LiFull Text:PDF
GTID:2298330431473264Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
During high-speed cutting tool workpiece, the tool will change the structure of the quality of work produced a great impact, resulting in accelerated tool wear and cutting efficiency decline, eventually leading to a failure rate of rise of the workpiece, in order to reduce the defect rate, to improve tool life. Therefore, the high-speed cutting tool manufacturing process parameters, cutting parameters and structural studies have important academic value and engineering application value.In Suzhou, a company for the production of silicon wafer processing zoned blade as the research object, this paper draw the blade from turning process manufacturing and electroplating process parameters optimization of cutting parameters and structural analysis of several aspects of the cutting performance. Theories based on the designated blade plating electroplating process parameters are described, draw the blade plating parameters affecting planning, based on orthogonal experiment analysis theory, draw the blade plating parameters were evaluated to arrive at the designated impact blade plating the parameters of the size factor, to draw the blade under different working conditions of the plating parameters are optimized experimentally by cutting parameters to optimize its cutting from spectral analysis on different structures designated by the blade pass noise test way, eventually come to draw the blade meets the requirements of the structure. Experimental results show that under normal load conditions the cutting structural plan after optimization can improve the cutting quality of the blade, while meeting the requirements of the cutting noise, to human needs, from the principle of optimization verify the feasibility of the noise.Blade manufacturing processes for planning, plating parameter optimization, cutting parameters analysis, noise test plan and test experimental demonstration areas such as the cutting of silicon wafers has some guiding significance and practical value.
Keywords/Search Tags:Draw the blade, Manufacturing process parameters, Orthogonal test, Noisetest, Structural optimization
PDF Full Text Request
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