Optimization Of Process Parameters Of The Antenna Device

Antenna equipment interconnection process has a strong relationship with forming process; it influences the part’s connection strength and warpage seriously. Moreover, it also affects the antenna equipment’s functional integrity and use of reliability. Start from the process parameters of the antenna equipment interconnection forming process, this paper optimizes the process parameters of forming process, for the guidance of forming process of antenna equipment interconnect.Major work of this paper is shown following:Firstly, this paper builds up model of interconnect forming process of antenna equipment. Specific model includes mathematics model of heat conduction,thermal stress model based on the laminated plate theory, and simulation model of the RF module and high and low frequency signal module. Meantime, this paper specify the simulation model, in the premise of ensure simulation result accuracy, minimized the simulation time.Secondly, this paper simulate the thermal field、stress field and strain field of interconnect forming process of electronic equipment RF module and high and low frequency signal module, focus on the simulation of forming process under heat condition. Analyzed the weldment thermal spread situation in each welding stage, using the birth and death element to kill the part that is not involved in welding, which makes them don’t transmit thermal, activated the part before the following welding stage, which participated in welding to realize thermal transmit; analyzed the maximum equivalent thermal stress of solder in four welding stage, obtain the law of maximum thermal stress, get the results of the maximum equivalent stress of solder welding stage; analyzed the deformation situation of each weldment after welding, through compare the value of each weldment deformation, this paper chose enclosure and PCB deform value as the quantitative index.Judgment of the optimum process parameter’s based on the orthogonal trial. In the range of process parameter value, this paper designs a orthogonal table of the interconnection process parameter, which also has been used to the simulation of interconnection welding process. This paper then process the simulate result of orthogonal experiment, through judgment of extreme value, gain the mainly interconnection process parameters, which is related to solder maximum equivalent thermal stress and weldment maximum deformation.Finally, this paper gives the builds up of function relationship and optimal process parameters solving. Based on the simulation result of orthogonal trial and judgment of mainly process parameters, obtain the function model of solder maximum equivalent thermal stress and weldment maximum thermal strain with mainly process parameters. Using the genetic algorithm solve the function model, this paper gives the optimal process parameters.