Study On MCZ33937EK Test And Reliability Improvement

Production test is important part for semiconductor products, with prosess scalesmaller, the cost for test even as high as half of the final cost for the device. Therequirement for semiconductor testing is becoming higher since the processingtechnology for semiconductor devices becoming more and more complex. The atuoIC need more strick requestion for testing because special application environmentand need more high standard of reliability.Usually, the semiconductor company willfind a good point to balance the cost and the customer satisfaction.This article will talk about the peripheral equipment and test principle for devicetest base on the Teradyne FLEX tester, and also talk about the failure analysisaccording to the principle of device operation. Improve leakage testing and stresstesting base on testing principle. The improve method is simulating the IC applicationduring using on extreme enviorment and repest testing to find out the protentialdisabled IC.There are some ideas of improvements and optimization for the old LEAKAGEtest and STRESS test program. Based on the analysis, these ideas will help to find outthe latent fallout effectively, and thinking of production cost and optimize the testflow at the same time, reduce the waste.so that to achieve the purpose for bothimprove the reliability and reduce the cost.