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The Research Of IC Final Test Temperature Accurate&Stable Control

Posted on:2014-06-22Degree:MasterType:Thesis
Country:ChinaCandidate:S L SunFull Text:PDF
GTID:2298330422468832Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
Test of semiconductor IC is a necessary and important process during thewhole semiconductor manufacturing. And the final test is the most important process,the final test yield is linked with semiconductor manufacturing cost directly. FreescaleSemiconductor is the leading manufacturer of microcontrollers, microprocessors andsemiconductors, design and manufacture the embedded semiconductor products onautomotive、consumer、industrial、networking and wireless marketing area.The automotive IC is more requirement than other IC’s in final test, normallyneed three temperature test plus burn in test. Semiconductor IC is more and moreprecision along with the new technology, also a challenge for Semiconductor final testequipment. The old version handler can’t meet the temperature requirement becausethe temperature control is not accurate.At the beginning of this article, introduce the general equipment and interfacehardware of final test area, and the relationship between the interface and equipment,the main structure and temperature setup of Castle handler. Then optimize andimprove the temperature performance through the flow and thermal simulation basedon the old version of Castle handler. Introduce the DTM concept, improve thehardware design based on the flow and thermal simulation, then well controlled theDUT thermal performance and make it more precision and stable, further improve thetemperature performance with the temperature cover and DTM combined. improvethe final test yield directly or indirectly. Design and improve some test hardwarethrough the positive result of the flow simulation, to save the time of hardwaredevelopment and cost.
Keywords/Search Tags:Semiconductor IC, Temperature Control, Handler
PDF Full Text Request
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