Researched On Constant Diameter Control Technology Of Silicon Microchannel Plates By Electrochemical Micro-Machining

Silicon microchannel plate (Si-MCP) is a novel photomultiplier devices, made by micromachining technology, with smaller aperture, higher resolution and easier for the preparation of high aspect ratio, compared with the conventional microchannel plates. Electrochemical micromachining technology is improved of electrochemically etched porous silicon technology and has the advantage of efficient production and low cost equipment. The fabrication of trenches with uniform pore size is one of the most important problems in electrochemical technology.Therefore, the work of my paper focus on analyzing the factors in constant diameter control technology then combine with the theory of electrochemical etching reaction. The electrochemical reaction in the microchannel is the decision of uniform pore size by electrochemical etching of silicon microchannel. Therefore, the experimental conditions are factors in the diameter control technology. Then, the influence of reaction conditions to the aperture change have been studied, such as the concentration of the solutions, bias voltage, temperature and surfactant. The experiments were carried out with different conditions. The influence of the above conditions was compared with each other and analyzed by the electrochemical corrosion theory and electrochemical impedance spectroscopy (EIS). Therefore, experimental conditions of electrochemical etching will be determined to achieve uniform pore size of the microchannel arrays. The optimum corrosion conditions:Corrosion voltage is0.5V, the temperature of13℃, the weight ratio of5%HF solution was added5%o of the anionic surfactant. The silicon microchannel arrays with uniform pore size and complete structure were obtained in this condition.